Development of China HDI PCB fabrication
2022-12-03 15:08:22 HDI PCB Fabrication 155 Viewed
SummaryType of quality for HDI PCB fabrication Here is China HDI PCB fabrication related description of the quality problem :1. Poor solder quality of HDI PCB fabricationPoor solder quality is one of the most serious problems in HDI PCB fabrication, which may be caused by surface pollution, oxidation, black...
Type of quality for HDI PCB fabrication
Here is China HDI PCB fabrication related description of the quality problem :
1. Poor solder quality of HDI PCB fabrication
Poor solder quality is one of the most serious problems in HDI PCB fabrication, which may be caused by surface pollution, oxidation, black nickel, abnormal nickel thickness and overly lengthy storage time. In this case, attention should be paid to the process capacity and quality control plan of the PCB factory.
2. HDI PCB fabrication resulted in layering
Layering in HDI PCB fabrication can occur due to improper preservation, excessive storage time, supplier material or process problems, design selection and poor distribution of copper surfaces.
3. Scratches and copper exposure on HDI PCB fabrication
Scratches and copper exposure caused by HDI PCB fabrication are the most challenging defects of PCB factory management system and execution.
4. Bending and warping of HDI PCB fabrication
The reasons for the bending of HDI PCB fabrication are material selection problems of suppliers, abnormal production processes, poor control of heavy industries, improper transportation or storage, large difference in copper area between layers and other factors.
5. Poor impedance of HDI PCB fabrication
The impedance of HDI PCB fabrication is an essential indicator related to the RF performance of mobile phone boards. A common problem is that there is a large difference in impedance between PCB batches.
The design skills of HDI PCB fabrication
HDI PCB fabrication is designed to maximize the density of surface components, provide breakthrough solutions and transmit high frequency signals for IC with a large number of closely spaced pins or pads. The following are the design techniques for HDI PCB fabrication:
1. HDI PCB fabrication can choose the through-hole type to minimize process complexity
The selection of a through-hole is a crucial decision in determining not only the required equipment and steps for HDI PCB fabrication, but also the processing time and additional costs involved.
2. The minimum number of components required for HDI PCB fabrication is optional
HDI PCB fabrication components determine the width, location, type and size of the route for drilling and stacking.
3. HDI PCB fabrication minimizes stress and EMI
When HDI PCB fabrication components are placed so that the through-hole locations are asymmetrically distributed, uneven stresses may be applied to the pcb board, which may result in warping and yield.
4. Routing of HDI PCB fabrication to minimize signal integrity issues
One of the advantages of HDI PCB fabrication is the ability to use a limited line width for signal propagation.
5. HDI PCB fabrication chose stacking to minimize material cost
In addition to the selection of through-holes, the choice of PCB lamination also had a significant impact on the cost of HDI PCB fabrication.
Orifice design for high speed HDI PCB fabrication
The pass hole design is an influential factor in HDI PCB fabrication. It consists of the hole, the pad area around the hole and the POWER layer isolation area. It is sometimes classified as blind hole, buried hole and through hole. Here are some considerations in the design of high-speed HDI PCB fabrication holes:
Select reasonable hole size for HDI PCB fabrication.
The bigger the POWER isolation area on HDI PCB fabrication, the better.
Signal routing on HDI PCB fabrication should not be changed as much as possible.
The use of thinner PCB board is conducive to reducing the two parasitic parameters of HDI PCB fabrication.
The pins of power supply and ground should be close to where HDI PCB fabrication is made. The shorter the lead between the pins and the pins, the better.
However, it needs to be analyzed on a case-by-case basis. Considering both cost and signal quality, when designing high-speed HDI PCB fabrication, engineers wanted as little a hole as possible so that there was extra wiring space on the pcb board and the parasitic capacitance was smaller, which was more suitable for high-speed circuits.
Status quo of China HDI PCB fabrication industry in 2022
HDI PCB fabrication technology enables smaller aperture, finer line width and fewer through-holes, saves PCB wiring area, significantly improves component density, and improves RF interference, electromagnetic interference and electrostatic discharge.
From the point of industry output value, with all kinds of wearable devices, intelligent head and on-board HDI permeability ascend, China HDI PCB fabrication market will still grow in the future.
From the point of HDI industry market competition, China HDI PCB fabrication market and home country distribution proportion does not match.
China HDI PCB fabrication automobile products market space is broad, from the in-car entertainment systems to the ADAS assistant driving and automatic driving system, carrying high speed computing chip within finite volume increase in the number.
HDI PCB fabrication requirements
High and multi-layer HDI PCB fabrication is a choice for numerous electronic and electrical terminal markets, such as high frequency communication, power backboard and network center. The requirements for HDI PCB fabrication are as follows :
1. Meet the HDI PCB fabrication requirements of customers' products
This kind of high-layer HDI PCB layer can be more than 28 layers, the thickness is commonly up to 5mm, can meet the requirements of customer RF circuit electromagnetic interference design.
2. Technical Points of HDI PCB fabrication
The design of HDI PCB fabrication is above 3 orders. Laser Stacked hole Via and Copper Fill technology are applied to achieve ultra-high density internal interconnecting wiring.
3. Technical performance test of HDI PCB fabrication
Meet the reliability requirements of customers for extreme electrical performance test, that is, pass 2000 cycles of test and the resistance shift rate is less than 10%.
HDI PCB fabrication electroplating hole filling advantages
In addition to eliminating the need for additional process development, the electroplating fabrication of HDI PCB fabrication is compatible with current process equipment and is conducive to achieving superior reliability.
1. The electroplating and hole filling technology of HDI PCB fabrication is conducive to the design of Stacked and Via-in-pad, which improves the density of the carrier plate.
2. The electroplating and hole filling technology for HDI PCB fabrication improves electrical performance, facilitates high frequency design, improves connection reliability, operating frequency and avoids electromagnetic interference.
3. Electroplating and hole filling technology for HDI PCB fabrication is conducive to heat dissipation.
4. The electroplating fabrication of HDI PCB fabrication is conducive to the completion of plugging and electrical interconnection in one step, which avoids the defects caused by resin and conductive adhesive filling as well as the inconsistent CTE caused by other materials filling.
5. The blind holes of HDI PCB fabrication were filled with copper plating to avoid surface depression and facilitate the design and fabrication of more precise circuits.
What is a black object on HDI PCB fabrication?
Some PCBs have a lump of black on top of them. What is the use of black as a result of HDI PCB fabrication? In fact, this is a kind of packaging, often called "soft packaging". Its composition material is epoxy resin, we typically see the receiving head receiving surface is also this material, it is inside the chip IC. This process is called "binding", we typically also call it "binding".
This is a wiring process in the process of chip production. Its English name is COB(chip on board), which means chip packaging. It is one of the bare-chip mounting technologies, and epoxy resin was used to mount chips on HDI PCB fabrication.
Advantages of COB in HDI PCB fabrication
The soft packaging technology of HDI PCB fabrication is commonly used to save costs. As the simplest bare-chip installation, such packaging is typically required to be formed at one time and placed on the copper foil surface of the circuit board in a round shape and black color in order to protect the internal IC from damage. The HDI PCB fabrication technology has the advantages of low cost, space saving, lightness, excellent cooling effect and simple encapsulation method.
The HDI PCB fabrication technology is used in LED lights, MP3 players, electronic organs, digital cameras, game consoles and other electronic products, as well as in the pursuit of low-cost circuits.
Automotive HDI PCB Fabrication type
The rapid development of the electronic industry has promoted the rapid development of various industries. HDI PCB fabrication is increasingly widely used in the automotive industry. HDI PCB fabrication technology has been widely used in the automotive industry, maybe with cross-floor blind holes or double-decker construction, due to the need to modernize and digitize automobiles and the desire for safety, comfort, simple operation and digitalization.
In automotive HDI PCB fabrication, traditional single layer PCB, double layer PCB and multi-layer PCB can be used, while in recent years the widespread application of HDI PCB fabrication has become the preferred choice for automotive electronics, providing service, safety and high quality for consumer electronics.
Automotive HDI PCB fabrication material requirements
Automotive HDI PCB fabrication consists of substrate, semi-cured sheet and solder resistance film. Automotive HDI PCB fabrication must rely on the lamination of at least two layers of prepreg and if insufficient cavities or adhesives occur, a single layer of prepreg may result in reduced insulation resistance and the end result may be the failure of the entire board or product.
The solder stop film for HDI PCB fabrication is a protective layer directly over the surface circuit board and plays the same essential role as the core board and preg. In addition to protecting the external circuit, the solder resistance layer also plays a crucial role in the appearance, quality and reliability of the product. Therefore, welding resistance in HDI PCB fabrication must meet the strictest requirements.
HDI PCB Fabrication Description
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HDI PCB fabrication stackups
HDI PCB fabrication stackup technology is a cutting-edge technology that is revolutionizing the design and manufacture of multilayer PCBs. HDI PCB fabrication provides an in-order build for the stackup, thus allowing more design options. Common HDI PCB fabrication stack structures are: 1+n+1, 2+n+2, 3+n+3, 4+n+4, etc.
Requirements for HDI PCB fabrication
The size of HDI PCB fabrication is limited by the capacity of production equipment, therefore, the size of suitable HDI PCB fabrication should be considered in the design. For small-sized HDI PCB fabrication, it should be designed as imposition to improve the production efficiency of the entire production line.
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