HDI Printed Circuit Boards Description

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Advantages of HDI printed circuit boards

HDI printed circuit boards can not only make the terminal product design more miniaturized, HDI printed circuit boards can also simultaneously meet higher standards of electronic performance and efficiency. The increased interconnect density of HDI printed circuit boards allows enhanced signal strength and improved reliability. HDI printed circuit boards have better improvement for RF interference, heat conduction, etc.

Processing difficulties of HDI printed circuit boards

HDI printed circuit boards significantly increase the consumption of processing capacity. The level of HDI printed circuit boards is determined by the number of repetitions of the sub-outer layer processing in the production process. Therefore, compared with the 1st-level HDI printed circuit boards, the 2nd-level HDI printed circuit boards with the same area need to use more pressure in the sub-outer layer processing. The production capacity of processes such as bonding, copper reduction, and laser needs to be doubled, and the production capacity required for the 3rd-level or any-level HDI printed circuit boards is more than three times that of the 1st-level.

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    HDI Printed Circuit BoardsHDI Printed Circuit Boards

    HDI printed circuit boards are circuit boards with relatively high circuit distribution density using micro-blind and buried via technology. The HDI printed circuit boards have inner layer lines and outer layer lines, and then uses drilling, in-hole metallization and other processes to realize the internal connection of each layer of lines....

    2022-11-07HDI Printed Circuit Boards

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