High Density Interconnect PCB Description

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High Density Interconnect PCB design guide

The designer must ensure that the High Density Interconnect PCB can be properly maintained, Determine the amount of space between specific components of the High Density Interconnect PCB and select additional space. High Density Interconnect PCB should consider through hole diameter, pad diameter and trace width.

High Density Interconnect PCB technology

The appearance of High Density Interconnect PCB technology adapts and promotes the development of PCB industry. The High Density Interconnect PCB board can be arranged on more dense BGA, QFP, etc. At present, the technology of High Density Interconnect PCB has been widely used, among which the first order of High Density Interconnect PCB board has been widely used in the production of 0.5PITCH BGA PCB.