Multilayer Flex PCB Introduction
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2022-11-21 10:48:45 Multilayer Flex PCB 545 Viewed
SummaryMultilayer Flex PCB production process Multilayer flex PCB products are widely used in communication equipment, computers, automotive electronics, industrial equipment, various household appliances, and other electronic products. Their main function is to support circuit components and interconnect c...
Multilayer Flex PCB production process
Multilayer flex PCB products are widely used in communication equipment, computers, automotive electronics, industrial equipment, various household appliances, and other electronic products. Their main function is to support circuit components and interconnect circuit components. With the application of computer gradually widespread, due to the high functional needs, make the wiring capacity of large, excellent transmission characteristics become the focus of Multilayer Flex PCB.
Multilayer Flex PCB is commonly made of inner-layer graphics that are etched into a single or double-sided substrate and into the specified layer, and then heated, pressurized, and bonded. Multilayer Flex PCBs can increase the number of wiring layers, thus increasing the design flexibility. To meet shielding, heat dissipation, and other special functions, multilayer Flex PCB can also be configured with a circuit, magnetic circuit shielding, and a metal core cooling layer.
In a word, with the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and ultra-large-scale integrated circuits, multilayer flex PCB is rapidly developing in a high-density, high-precision, high-level digitalization direction. There are micro-lines, narrow apertures through blind holes, buried holes, thick plates with steep aperture ratios, and additional technologies to meet the needs of the market.
What is Multilayer Flex PCB
Multilayer Flex PCB is three or more layers of single-sided or double-sided flexible circuit laminated together, through drilling, electroplating to form a metallized hole, forming a conductive path between different layers. Multilayer Flex PCB does not need complicated soldering process. Multilayer Flex PCB has high reliability, better thermal conductivity and easier assembly. Flex PCB is generally divided into single-layer Flex PCB board, double-layer Flex PCB board, multilayer Flex PCB board, double-sided board, etc.
Type of Multilayer Flex PCB
The multilayer Flex PCB is made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth multilayer PCB board, but it loses the excellent flexibility of single-sided, double-sided soft PCB. Most of these products do not require flexibility. Multilayer Flex PCB can be further classified as follows :
1. Flexible insulating substrate products
This class is manufactured on a flexible insulating substrate and the finished product is specified to be flexible. To increase the height flexibility of Multilayer Flex PCB, a thin, suitable coating, such as polyimide, can be used on the wire layer instead of a thick laminated overlay.
2. Soft insulating substrate products
This class is manufactured on a soft insulating substrate, the end of which is specified to be flexible. This class of Multilayer Flex PCB is made with a soft insulating material, such as polyimide film, laminated into a multilayer board that loses its inherent flexibility after lamination.
Multilayer Flex PCB technology development
With the development of consumer electronics toward miniaturization and lightness, in order to adapt to the trend of downstream industries, it is also moving in the direction of high-density, ultra-fine, and multi-layer materials. The development of multilayer flex PCB technology meets the requirements of a more refined size.
Although there is a gap between Chinese local enterprises and international leading enterprises, after less than 10 years of development, the multilayer flex PCB manufacturing technology of some factories has also broken through the 40-50um line width pitch and 70-80um aperture technology, and further to the line width pitch below 40um and 60um aperture process capability breakthrough.
In order to improve the yield of multilayer flex PCB production, the FPC production process has changed from "chip to chip" to "roll to roll." With the roll-to-roll production process gradually reaching a stable state, FPC production will shift from semi-automated production to wholly automated production, which considerably improves the production efficiency and yield of multilayer flexible PCB.
Based on the production cost and technical requirements of Multilayer Flex PCB, addition method will replace subtraction method as the main FPC line preparation process. Although the technical threshold is low, the process is complicated, and a large amount of copper foil needs to be corroded, therefore the production cost is elevated. It is typically suitable for the production of 30-50um lines, and suitable for the production of high value-added refined products.
Based on the high yield and low cost requirements of Multilayer Flex PCB, FPC prefers to use substrates with strong dimensional stability. For the Multilayer Flex PCB production process, the stability of the selected substrate size is a key factor for manufacturing success. Because the shrinkage of the substrate geometric size will directly affect the precise positioning between the circuit layer and the covering film, thus affecting the alignment of the device assembly, it is altogether essential to choose flexible plate substrates with extra strict size control.
Multilayer Flex PCB features
Multilayer flex PCB has the advantages of high assembly density, small volume, light weight, and so on. Because of the high-density assembly, the connection between parts is reduced, so the reliability is increased. can increase the wiring layer and then increase the design elasticity, which can also affect the impedance of the circuit. Multilayer Flex PCB technology is capable of forming a specific high-speed transmission circuit, setting the circuit, electromagnetic shielding layer, but also installing the metal core layer to meet the special thermal insulation functions and requirements, easy installation, and high reliability.
Advantages of Multilayer Flex PCB
Multilayer Flex PCB has the following 7 advantages:
1. Multilayer Flex PCB assembly time is short
2. Multilayer Flex PCB is small in size
3.Multilayer Flex PCB is lighter than rigid board
4. The thickness of Multilayer Flex PCB is smaller than that of PCB
5.Multilayer Flex PCB assembly density is high
6.Multilayer Flex PCB has high reliability
7.Multilayer Flex PCB is easy to install and has high reliability
Disadvantages of Multilayer Flex PCB
Multilayer Flex PCB has the following 3 Disadvantages:
1. The manufacturing cost of Multilayer Flex PCB is high
2.Multilayer Flex PCB production cycle is long
3. The quality inspection process of Multilayer Flex PCB is complicated.
Multilayer Flex PCB Description
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Multilayer flex PCB structure
Multilayer Flex PCB by "multiple single-side CCL (or double panel) + pure glue + protective film (CVL)" pressed together, Multilayer Flex PCB through the PTH hole will be connected to each layer wire, due to too many layers, Poor flexibility of Multilayer Flex PCB (good flexibility of pure rubber opening design area)
Advantages of multilayer flex PCB
Like rigid Multilayer PCB, Multilayer Flex PCB adopts multi-layer lamination technology. The advantages of Multilayer Flex PCB are that the substrate film is light weight and has excellent electrical characteristics. The Multilayer Flex PCB made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth Multilayer PCB board, but the Multilayer Flex PCB loses the excellent flexibility of single-sided, double-sided soft PCB. Most of these products do not require flexibility.
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