Multilayer PCB Prototype

Multilayer PCB prototypes are used as the "core force" in the fields of communications, medical care, industrial control, security, automobiles, electric power, aviation, military industry, and computer peripherals. Multilayer PCB prototype products have more and more functions and more and more dense lines. In contrast, the difficulty of production is also increasing. With the rapid development of mobile phones, computers, and electronic digital industries, multilayer PCB prototype manufacturers are also constantly meeting the needs of the market and consumers, which has promoted the continuous sharp increase of the industry's output value.

In 2022, the competition in the multilayer PCB prototype industry is intensifying, and many multilayer PCB prototype manufacturers will not hesitate to lower prices to attract a large number of customers. However, low-price pcb boards must use cheap materials, which will affect the quality of multilayer PCB prototype products, short service life, and multilayer PCB prototype products are prone to surface damage, impact marks and other quality problems.

Requirements for Multilayer PCB Prototypes

The purpose of the multilayer PCB prototype is to determine the strength of the PCB manufacturer, to effectively reduce the defective rate of the multilayer PCB prototype, and to lay a solid foundation for future mass production.

Nowadays, the development of multilayer PCB prototype enterprises pays special attention to the quality of products. In the manufacturing industry, the improvement of product quality also plays an important role in the industry's reputation. Multilayer PCB prototypes have good quality in the circuit board manufacturing industry. Therefore, before mass production, customers will choose multilayer PCB prototype suppliers to conduct multilayer PCB prototypes to verify whether the performance of the circuit design meets the requirements.

1. Clean appearance: the appearance of the product that needs to be produced during the multilayer PCB prototype is flat and there are no burrs on the corners, and there will be no blistering and delamination between the wires and the solder mask. The multilayer PCB prototype board can ensure a better welding effect, and there will be no problem of connection obstruction for a long time during use, and the cleanliness of this appearance also ensures that the multilayer PCB prototype produced by the merchant meets the appearance requirements of actual use.

2. Requirements for CAM optimization: To obtain a higher-quality multi-layer PCB prototype board, it is necessary to perform relevant CAM processing on the multilayer PCB prototype. This processing method adjusts the line width and optimizes the spacing between pads. Only in this way can we ensure that the circuit interaction between multilayer circuit boards has better signals, making the quality of multilayer PCB prototypes more superior.

3. Reasonable requirements for the multilayer PCB prototype process: after the multilayer PCB prototype, it is also necessary to study whether its process is reasonable, for example, whether there may be mutual interference between the lines, and whether the problem of solder joint connection during welding good tin is also very important. In this design, the electronic components made of multilayer circuit boards will also ensure longer and smooth operation.

The Two Sides of Multilayer PCB Prototypes

Advantage:

The multilayer PCB prototype board has high assembly density, small size, and light weight. Due to the high assembly density, the connections between components (including components) are reduced, thereby improving reliability; the number of wiring layers can be increased, thereby enlarging the design flexibility; can form a circuit with a certain impedance; multilayer PCB prototype board can form a high-speed transmission circuit; can set the circuit, magnetic circuit shielding layer, and can also set the metal core heat dissipation layer to meet the needs of special functions such as shielding and heat dissipation; easy to install, high reliability.

Shortcoming:

The cost of multilayer PCB prototype board is high; the cycle is long; and high reliability detection methods are required. The multi-layer PCB prototype is the product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and ultra-large-scale integrated circuits, multilayer PCB prototype boards are rapidly developing in the direction of high density, high precision, and high-level digitization. Blind and buried vias, high thickness-to-aperture ratio and other technologies to meet the needs of the market.

Considerations for Multilayer PCB Prototyping

The production method of multilayer PCB prototype is generally to do the inner layer graphics first, and then make a single-sided or double-sided substrate by printing and etching method, and put it into the specified layer, and then heat, pressurize and bond it. Drilling is the same as the plated through hole method for double-sided boards. However, as the materials and process technologies of multilayer PCB prototype boards (such as: press-fit bonding technology, solution to slag generated during drilling, and film improvement) become more mature, the characteristics attached to multilayer PCB prototypes are more. Variation.

1. Use the additive method. This method multilayer PCB prototype is to expose the required places through the combination of ultraviolet light and photoresist, then use electroplating to thicken the circuit, then cover with anti-corrosion resist or metal thin tin, and then coat photoresist and Etch away the underlying copper foil layer.

2. Use subtraction. This method is mainly to use chemicals to remove unnecessary places on the blank circuit board, and the remaining places are the necessary circuits. Multilayer PCB prototype design and processing mainly use screen printing or photosensitive plate and engraving for processing. Remove unnecessary parts.

3. The method of stratification. This method is a very common method in the design and processing of multilayer PCB prototypes, and it is also the main method for making multilayer PCB prototypes. It achieves the production of multi-layer PCB prototypes through the processing process from the inner layer to the outer layer, and then using subtraction or addition, and constantly repeating the process of layering. One of the most critical processes is build-up, where printed circuit boards are added layer by layer and processed repeatedly.

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