PCB Assembly Massachusetts

2022-12-09 10:53:54 PCB Assembly Massachusetts 436 Viewed

PCB assembly Massachusetts technology

PCB assembly Massachusetts manufactures circuit boards loaded with a large number of components and relatively short distances between the components. The increase in the power of the components and the decrease in the heat dissipation space make the heat relatively concentrated. Surface mounted components of PCB assembly Massachusetts can not install the radiator, only by radiation and air convection heat is not easy to distribute, and even in some cases the convection heat dissipation effect is not excellent, resulting in PCB assembly Manufacturers printing circuit boards rising temperature. Serious will cause device performance decline, the machine running accuracy is poor, even can not work.

After the production of PCB assembly Massachusetts, the structural form must take measures to facilitate heat dissipation, especially the miniaturized electronic equipment most of the use of greatly integrated large-scale integrated circuits and porcelain structure of the function block. PCB assembly Massachusetts used the surface mount technology for printed boards. In order to adapt to the attachment of unled components, the PCB thermal expansion coefficient must be closely controlled.

PCB assembly Massachusetts for consumer electronics applications

PCB assembly Massachusetts has seen a dramatic increase in the number of consumer electronics applications and shows no signs of slowing down. Consumer electronics make our lives easier, including applications such as communications and base stations, making our lives simpler and more relaxed. The electronic products we use every day are designed for PCBA circuit boards, such as smart phones, tablets, computers, etc. As PCB assembly Massachusetts technology advances, they are also part of iot devices such as smart thermostats, smart refrigerators and more.

As portable electronic devices become smaller, thinner, lighter and more durable, among others, PCB assembly Massachusetts produces PCBA products that are optimized for these applications.

PCB assembly Massachusetts inspection classification

PCB assembly Massachusetts inspection items are divided into four categories: material inspection, process inspection, identification inspection and quality consistency inspection.

1. Material inspection of PCB assembly Massachusetts

Material inspection in PCB assembly Massachusetts is an essential part of the PCB manufacturer's process quality control. It verifies that the materials used in the printed board are respected and qualified.

2. Process inspection of PCB assembly Massachusetts

PCB assembly Massachusetts will set up appropriate inspection points according to its own production quality stability, process characteristics and product quality grade requirements. It is the basis for ensuring the quality of the final product and an essential part of the quality assurance system.

3. Identification and inspection of PCB assembly Massachusetts

PCB assembly Massachusetts' qualification tests are used to demonstrate that PCBA manufacturers are capable of producing the products specified in the standard and that the qualification tests must meet all requirements for the specified product grade.

PCB assembly Massachusetts selective solder cause

With the development of electronic equipment towards the direction of intelligence, it needs further circuit boards to undertake the control system of these equipment, and the quality of PCBA processing determines the service life of the equipment. Here are some common reasons for PCB assembly Massachusetts selective solder.

1. The weldability of PCB assembly Massachusetts selective solder plate holes affects the welding quality

If the solubility of the circuit board hole is not perfect, the PCBA processing welding defects will be generated, which will affect the parameters of the components in the circuit and lead to the instability of the multilayer components and the inner line, thus affecting the functional failure of the entire circuit.

2. PCB assembly Massachusetts selective solder defects caused by warping

Warping occurs during welding of circuit boards and components, and the stress deformation causes welding defects such as solder joints and short circuits in PCBA processing. Warping is usually caused by the temperature imbalance between the upper and lower parts of the board.

3. PCB design affects welding quality

In PCB design layout, welding is easy to control, but the temperature is too low, the heat dissipation is reduced, welding is difficult to control.

PCB assembly Massachusetts selective solder factor

PCB assembly Massachusetts selective solder factors include the composition of solder and solder performance. Solder is an essential part of the welding chemical process, it is composed of chemical substances containing flux. To prevent the oxides produced by the impurities from being dissolved by the flux, the flux serves to help the solder wet the surface of the plate to be welded by transferring heat and removing rust. White rosin and isopropyl alcohol solvents are commonly used.

Welding temperature and metal surface cleanliness also affect the weldability of PCB assembly Massachusetts selective solder. When the temperature is overly steep, the solder diffusion speed is accelerated, the circuit board and the solder melting surface are rapidly oxidized, resulting in solder defects, and the surface of the circuit board is polluted, but also affect the weldability and cause defects, including tin beads, tin balls, broken circuit, poor gloss, etc.

PCB assembly Massachusetts selective solder method of producing pores

When PCBA plates are welded, they create air holes, which are usually referred to as bubbles. Air holes normally appear in reflow welding and wave soldering. Excessive air holes will cause damage to PCB boards. The following is how to prevent air holes in PCB assembly Massachusetts selective solder.

  1. 1. Bake
    2. Control of solder paste
    3. Workshop humidity control
    4. Set a reasonable furnace temperature curve
    5. Flux spraying
    6. optimize the furnace temperature curve

There may be many factors that affect the porosity of PCB assembly Massachusetts selective solder. To analyze from PCB design, furnace temperature, tin wave height, PCB humidity, chain speed, solder composition, flux and other aspects, it is necessary to obtain a better process after several times of debugging.

PCB assembly Massachusetts selective solder key points

1. Composition and weldability of welding raw materials

PCB assembly Massachusetts selective solder welding key includes welding wire, welding materials and additional related welding raw materials. The chemical shift in the whole welding process is the key step in the whole welding process of circuit board.

2. Welding method

PCB assembly Massachusetts selective solder PCB assembly Massachusetts selective solder must choose the welding mode according to the detailed situation when welding. The key is to choose according to the difference of the dissolution point of the welding material. The welding raw materials can not be selected.

3. Welding temperature

PCB assembly Massachusetts selective solder board welding temperature is also a key factor to harm welding quality. If the welding temperature is overly steep, the diffusion speed and specificity of the welding material will be increased, which will cause the welding quality of PCBA circuit board to fail to meet the shipping standard.

4.  Wash the surface of the circuit board

If the surface of the circuit board is not tidy, there will be fragments, thereby endangering the welding quality.