Quick turn PCB fabrication methods

With the continuous improvement of electronic communication technology, more and more traditional circuit board manufacturing methods can no longer meet the requirements of this era of rapid development. It is undoubtedly the biggest challenge for circuit design engineers to quickly turn PCB fabrication into high-precision, high-performance and cost-saving pcb circuit boards.

1. Quick turn PCB fabrication method

There are various kinds of quick turn PCB fabrication methods, but the main quick turn PCB fabrication methods are physical and chemical.

The physical method of quick turn PCB fabrication is to remove unwanted copper from the board using a variety of cutters, hand and power tools.

The chemical method for Quick turn PCB fabrication is to cover the blank copy-coated plate with a protective layer to remove unnecessary copper from the corrosive solution, which is a method usually used in quick turn PCB fabrication. There are various ways to cover the protective layer in Quick turn PCB fabrication factory, including the most traditional manual painting method, the custom adhesive method, the film photographic method and the recently developed thermal transfer printing of PCB board.

2. Advantages and disadvantages of two quick turn PCB fabrication methods

The physical method of quick turn PCB fabrication: the advantage is that only relatively simple lines are used. Disadvantages are time-consuming, precision is not easy to control and there is no recovery, the operation requirements are extremely steep, hardly used at present.

Chemical method for quick turn PCB fabrication: The advantage is controllable accuracy, which is also the most widely used quick turn PCB fabrication method at present. The disadvantage is that the process is relatively complex and there are numerous problems.

Low cost of quick turn PCB fabrication

Money is a public resource that we all want to save, whether we are businesses or individuals. When it comes to PCB boards, it makes sense not to sacrifice quality on price, but that doesn't mean there aren't alternative ways to save money. The cost of quick turn PCB fabrication depends on various factors. Taking these factors into consideration when designing products can reduce the cost of quick turn PCB fabrication to the greatest extent.

1. Reduce the size of quick turn PCB fabrication

One of the main factors that can have an impact on the production cost of a quick turn PCB fabrication is the size of the printed circuit board. If a larger board is required, it will be easier to route but more costly to produce. And vice versa, all depends on how complex the final product needs to be.

2.  Top-quality materials should be selected for quick turn PCB fabrication.

If low quality materials are used for quick turn PCB fabrication, it is easy to cause problems and further money will be spent. The increase in cost can be avoided if PCB fabrication is quick turn by selecting top-quality materials.

3. Quick turn PCB fabrication requires the use of standard circuit board shape

Unless you need to design a PCB with a custom shape, it is normally best to use the standard board shape.

4. Adhere to quick turn PCB fabrication industry standard dimensions and components

Using standard surface-mounted components helps reduce the number of holes that need to be drilled into the board.

5. Prolonged delivery time

In order to reduce any additional costs, please try to make the delivery time longer, which means lower cost for quick turn PCB fabrication.

China quick turn PCB fabrication process

Double-sided PCB quick-turn fabrication: dressing board side dimensions - copying - drilling - gluing - corrosion - cleaning - de-gluing - sandpaper polishing - rosin coating.

1. Quick turn PCB fabrication is to polish the surface of the copper sheet that meets the size requirements with fine sandpaper and then copy the wiring drawing on the copper sheet with carbon paper.

2. Quick turn PCB fabrication with 1.0mm diameter drill bit drilling, positioning, and then glue (or paint).

3. After sticking the glue, put a thick sheet on the board and press it with the palm of your hand. The purpose is to make all the glue and the copper-clad plate more reliable, and the effect is better.

4. Quick turn PCB fabrication corrosion typically uses ferric chloride as corrosion liquid, corrosion speed and the concentration of corrosion liquid, temperature and corrosion process to take jitter related, in order to ensure the quality of the board and improve the corrosion speed, can use the method of jitter and heating.

5. Quick turn PCB fabrication of corrosion, after the completion of application of tap water is rinsed clean, and tape, the printing plate wiped dry.

6. Wipe the copper surface of the printing board with fine emery cloth until it is bright, and then immediately apply the rosin solution.

Get China quick turn PCB fabrication

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