FR4 PCB board substrate classification

FR4 PCB board is generally classified as the insulating part of the substrate. Common FR4 PCB board substrate raw materials include electric board, fiberglass board and various plastic boards. PCB manufacturers generally use an insulating part composed of glass fiber, fabric material, and resin, and then use epoxy resin and copper foil to press into an adhesive sheet. The common FR4 PCB board substrate classifications are: FR-1, FR-2, FR-3, FR-4, FR-5, FR-6, G-10, CIM-1, CIM-2, CIM-3, CIM-4, CIM-5, AIN, SIC, etc.

FR4 PCB board material procurement principles

1. 1) For alike electronic products, the use of FR4 PCB board material (epoxy glass fiber wiki board).

2. 2) For the use of high ambient temperature or flexible circuit boards, polyimide glass fiber wiki board, FR4 PCB board material can not meet the requirements.

3. 3) For high frequency circuit, it is necessary to use PTFE fiberglass wiki board, ordinary FR4 PCB board material has no advantage.

4. 4) For electronic products with high heat dissipation requirements, metal substrate should be used.
   
   

What factors will affect the production of fr4 PCB board?

During the entire production process, the following factors may harm the production of FR4 PCB board.

1. 1. Hot air leveling of FR4 PCB board material must be reworked

2. 2. Pay attention to the welding of the first side of FR4 PCB board material

3. 3. Pay attention to the welding of the second side of FR4 PCB board material

4. 4. Wave soldering of FR4 PCB board material

5. 5. Dismantle the failed BGA and CSP of FR4 PCB board material

6. 6. FR4 PCB board material welding new BGA, CSP

7. 7. FR4 PCB board material manual welding some special devices
   
   

Considerations for selecting FR4 PCB board material

1. FR4 PCB board material should be selected as suitable substrate with elevated glass transition temperature (Tg). The Tg value should be higher than the operating temperature of the circuit.

2, FR4 PCB board material thermal expansion coefficient (CTE), if the X, Y and thickness direction of the thermal expansion coefficient is inconsistent, it is easy to cause PCB deformation, serious will cause mutilation hole fracture and component damage.

3. the requirements of high heat resistance, the general requirements of FR4 PCB board material can have 250℃ / 50S heat resistance.

4. Good flatness is required. The warpage degree of FR4 PCB board material of SMT is required to be <0.0075mm.

5. In terms of electrical performance, long frequency circuit requires the selection of materials with high dielectric constant and small dielectric loss. FR4 PCB board material insulation resistance, voltage strength, arc resistance to meet the requirements of the product.

Aluminum substrate and FR4 PCB board difference

The basic structure of aluminum substrate and fr4 pcb board is different in different characteristics. The differences between aluminum substrate and fr4 pcb board are:

1. 1. The performance of aluminum substrate and fr4 pcb board is different.

2. 2. The machinability of aluminum substrate and fr4 pcb board is different.

3. 3. Electromagnetic shielding of aluminum substrate and fr4 pcb board is different.

4. 4. The thermal expansion coefficient of aluminum substrate and fr4 pcb board is different.

5. 5. Aluminum substrate and fr4 pcb board application circuit, field are different.

Get China FR4 PCB board

Reprint: Thank you for your recognition of the website platform and your favor on our original works and articles. You are very welcome to share with your personal webmaster or circle of friends, but please indicate the source of the article "https://www.infopcb.com" when reprinting.