FPC fabrication features

1. Flexibility: it can maintain its integrity and function in the case of bending and folding, and can adapt to various complex electronic product design requirements.

2. Thin and light: compared with the traditional hard board, FPC board has the characteristics of very thin and light, and can be widely used in limited volume equipment.

3. High density: The FPC board can achieve high density circuit layout because its lines can be stacked together through multiple layers, resulting in smaller size and higher functional integration.

4. High reliability: the connector and terminal of the FPC board can be connected by hot pressing or welding, so as to improve its reliability and vibration resistance.

5. Short production cycle: FPC fabrication cycle is usually shorter than that of traditional hard board, which can quickly produce high-quality products.

Single-sided FPC fabrication process

Cutting → drilling → film printing → alignment → exposure → development → etching → stripping → surface treatment → film coating → pressing → curing → surface treatment → Precipitation of nickel gold → printing characters → cutting → electrical measurement → punching → Final inspection → Packaging → Shipping

Double-sided FPC fabrication process

Cutting → drilling →PTH→ Electroplating → Pretreatment → film exposure → alignment → exposure → Development → Pattern plating → Stripping → pretreatment → film exposure → alignment exposure → Development → etching → stripping → Surface treatment → Covering film → Pressing → curing → nickel out of gold lettering → printing → Cutting plate → Electrical measurement → punching → Final inspection → Packaging → Shipping

Get FPC fabrication features

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