China High Speed PCB Design Guidelines

what is high speed pcb design Guidelines？

High speed pcb design refers to any design in which the integrity of the signal begins to be affected by the physical characteristics of the pcb. The physical characteristics of a high speed pcb design include layout, packaging, interconnect, and layer stacking. When using high speed pcb design, the most important thing to consider is their distance from the signal, the width of the signal, where to place the track, and the kind of track they have, so that the high speed pcb design process can be taken to the next level.

China High speed pcb design guidelines

To meet the demands of today's electronic products, digital circuits are becoming faster and faster.  High speed pcb design used to be an obscure area of electronics, but today, most products require "high speed pcb design." High speed pcb designer arranges circuit boards in accordance with high speed pcb design guidelines and requirements. The following are common high speed pcb design guidelines. Hope to help you with your high speed pcb design.

Schematic information of high speed pcb design guidelines

1. 1. Some components of high speed pcb design may need to be placed on a certain side of the circuit board.

2. 2. Wiring is prohibited around key components in high speed pcb design.

3. 3. Routing information in high speed pcb design includes routing topology, measured length and matching length.

4. 4. Differential pairs and controlled impedance information in high speed pcb design.

PCB library of high speed pcb design guidelines
Device footprint for high speed pcb design must be checked and validated just like the pcb layout, and some additional database work is also involved.

Materials and devices of high speed pcb design guidelines

Before you begin layout design, you must select materials that will allow you to make a high speed pcb design, such as whether you have a stock of reinforced epoxy or PTFE materials. pcb devices also need to be reviewed and validated by the high speed pcb manufacturer.

High speed pcb design guidelines board stacking

High speed pcb designs require specific board stacking in order to achieve EMI shielding and signal integrity. The board stacking for high speed pcb designs needs to be established in the pcb CAD database or imported from an external source.

High speed pcb design guidelines

The high speed pcb design guidelines have the following design rules :

1. 1. Differential pair rules for high speed pcb design

2. 2. Signal path rules of high speed pcb design

3. 3. Routing topology rules for high speed pcb design

4. 4. High speed pcb measurement and matching line length rules

5. 5. High speed pcb design cable adjustment parameter rules

System parameters of high speed pcb design guidelines

The parameters in the high speed pcb design guidelines are very important and include display parameters such as color and fill patterns, grids, wiring preferences, and a host of other parameters. By managing these parameters, high speed pcb designers can increase efficiency when using tools.

China High speed pcb design device placement guide

The placement of components in a high speed pcb design should follow the same rules as the standard design placement.  High speed pcb design is different in that it requires optimal signal integrity throughout the design. A major part of the signal integrity of a high speed pcb depends on having a clear signal return path on the ground plane and ensuring that the digital and analog circuits are separated from each other. The following is the high speed pcb design device placement guide:

1. 1. Leave space for clear signal return path on the reference plane of high speed pcb.

2. 2. In high speed pcb design, the spacing of wiring channels should be set aside for the dense data and memory bus wiring.

3. 3. In high speed pcb design, avoid placing components in areas where analog and digital circuits cross each other.

4. 4. High speed pcb components placed to ensure that the high speed signal path is short.

5. 5. The signal path of high speed pcb can include multiple devices in the path, which should be placed according to the layout in the schematic diagram.

6. 6. Analog components of high speed pcb designs should be placed together as much as possible to reduce their line length.

Get China High Speed PCB Design Guidelines

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