High Density Interconnect PCB

The Rise of High Density Interconnect PCBs

As the distance between devices shrinks, engineers are noticing the relationship between the rise time of inter-device signals and the overall package size. Reducing the tracking distance (the space from one device to the next) reduces the time it takes for the voltage between devices to reach the desired level, both because of the lower distance and because the corresponding capacitance is smaller. This helps improve the performance of products designed using the high density interconnect PCB technology in development.

The dual forces of increased functionality and reduced package size have combined to drive the development of high density interconnect PCBs. Adding new features and functions to electronics requires additional components and circuits, but market demands, whether consumer or commercial, require increasingly smaller footprints and lower power consumption (often in the form of batteries). lifespan. High density interconnect PCBs first solved the problem of how to mount components more efficiently.

High density interconnect PCB technology goes far beyond the miniaturization of circuit designs. It represents a major breakthrough in the electronics industry. Implementing a high density interconnect PCB at a modern level involves making changes in materials, imaging, assembly, testing, and design. This article examines these changes and looks ahead to what we might see in the near future, as high density interconnect PCBs continue to change the way we look at complex, compact circuits and the devices they enable.

What is a High Density Interconnect PCB?

High density interconnect PCBs are special PCB boards that have more interconnects and take up minimal space. This results in miniaturization of the board, placing components closer together, and significantly reducing PCB space for high-density interconnects, without compromising functionality.

More precisely, a PCB with an average of 120 to 160 pins per square inch is considered a high density interconnect PCB. High density interconnect PCB design incorporates dense component placement and versatile routing. High density interconnect PCBs popularized microvias technology. Create denser circuits by implementing microvias, buried vias, and blind vias. Reduced copper drilling in high density interconnect PCB designs. High density interconnect PCBs are a technology for producing printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology. With the continuous development of science and technology, in order to meet the electrical requirements of high-speed signals, the circuit board must provide impedance control with AC characteristics, high-frequency transmission capability and reduce unnecessary radiation (EMI). Sometimes, in order to reduce the quality problems of signal transmission, insulating materials with low dielectric constant and low attenuation rate are generally used. In order to better match the miniaturization and arraying of electronic component packaging, high density interconnect PCBs are also continuously increasing the density to meet the requirements.

Versatility: High density interconnect PCBs boards are ideal where weight, space, reliability and performance are key considerations.

Compact design: Combination of blind vias, buried vias and micro vias reduces performance space requirements for high density interconnect PCBs. 

Better signal transmission: High density interconnect PCBs utilize in-pad and blind via technology. This helps keep components close to each other, reducing signal path lengths.

Reliability: The implementation of stacked vias makes these high density interconnect PCBs a super barrier against extreme environmental conditions.

Cost effective: The functionality of a standard 8-layer through-hole board (standard PCB) can be reduced to a 4-layer high density interconnect PCB without compromising quality.

Difficulties of High Density Interconnect PCBs

High density interconnect PCBs are generally HDI high multilayer circuit boards with 8 or more layers, which are more difficult to process than traditional multilayer circuit boards, and have high quality and reliability requirements.

●Material selection: All PCB designs take into account material and component selection, but for high density interconnect PCBs, there are unique manufacturing constraints. The material chosen will affect the electrical performance of the signal traces and, of course, the cost of the final high density interconnected PCB product.

●Microvia stacking : An efficient design can take advantage of high density interconnect PCBs to stack microvias instead of staggered.

●Interconnect per layer (ELIC): This technology now popular in smartphone construction provides tighter pitches, eliminating mechanical vias within the board, and taking up space for high density interconnect PCBs.

●Blind area and buried area distribution holes: The asymmetrical design of the stack can cause uneven pressure, resulting in warpage of the high density interconnect PCBs.

●Component placement: The density of high density interconnect PCBs technology requires close attention to placement to ensure the feasibility of soldering, mounting, and maintaining the board. This will facilitate any necessary rework by allowing maximum space tolerance while still utilizing the available density.

●Track uniformity and minimum line width: These factors are important considerations for avoiding open and short circuit conditions.

Manufacturing costs should be considered before deciding to utilize high density interconnect PCBs electronics. This is especially true for high density interconnect PCBs electronics manufacturing, as PCB design considerations define the high density interconnect PCBs manufacturing process and affect whether and how much additional time and cost is required to manufacture a circuit board.

High Density Interconnect PCB Technology

High density interconnect PCBs have high-density properties, including laser microvias, sequential laminate layouts, fine lines, and high-performance thin materials. This increased density enables more efficacy per unit area. Advanced technology high Density Interconnect PCBs feature multiple layers of copper-filled stacked microvias that allow for more complex connection layouts. These complex layouts provide the required routing and signal integrity solutions for the large pin count, fine pitch, and high speed chips found in today's high-tech products.

This advancement in high density interconnect PCBs technology using finer partitions supports high-end functions for innovative new products, including: 5G, communications, networking equipment, IoT, medical patients monitoring wearables, autonomously used PCBs, lidar systems, vehicle-to-everything (V2X), communications and military satellites, aviation appliances, and smart munitions.

Laser-drilled microvias for high density interconnect PCBs have drill diameters as small as 0.004" (100m), optically aligned with pad diameters as small as 0.008", increasing routing density. Microvias can be via-in-pad (for crisp component placement), offset, staggered or stacked, non-conductive fill, top copper plated or fill or solid copper plated. Microvias add cost when routing from finely spaced BGAs (say, 0.8mm pitch parts and below).

Also, microvias add to the cost when wiring from 0.5mm breakout devices that can use staggered microvias. However, routing tiny BGAs (eg, 0.4mm, 0.3mm, or 0.25mm partition devices) requires stacked microvias using inverted pyramid routing technology.

High density interconnect (HDI) technology is one of the most important innovative advancements in PCB electronics manufacturing that has resulted in ever-smaller electronics. High density interconnect PCBs can be described as electronic development SMD trace routing that utilizes advanced board manufacturing equipment and processes to optimize and meet the higher component density and smaller packaging requirements of the competitive electronics industry. The development of high density interconnect PCBs electronics requires coordination between board design and manufacturing, which can only be achieved with an understanding of board manufacturing and PCB assembly.

The Effects of High Density Interconnect PCBs

1. High density interconnect PCBs can comprehensively increase the circuit density.

2. High density interconnect PCBs can improve economic benefits and avoid excessive cost output.

3. High density interconnect PCBs can effectively improve and perfect thermal properties.

4. High density interconnect PCBs facilitates the application of new packaging technologies.

5. The High density interconnect PCBs itself has extremely high performance, and the obtained signal has a high accuracy rate.

6. The reliability and safety of high density interconnect PCBs are strong.

7. High density interconnect PCBs can prevent interference from adverse factors.

8. High density interconnect PCBs improve design efficiency to a certain extent.

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